Datasheet
SiHP25N40D
www.vishay.com
Vishay Siliconix
S12-0625-Rev. B, 26-Mar-12
2
Document Number: 91483
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THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL TYP. MAX. UNIT
Maximum Junction-to-Ambient R
thJA
-62
°C/W
Maximum Junction-to-Case (Drain)
R
thJC
-0.45
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-Source Breakdown Voltage V
DS
V
GS
= 0 V, I
D
= 250 μA 400 - - V
V
DS
Temperature Coefficient
V
DS
/T
J
Reference to 25 °C, I
D
= 250 μA
-0.5-
V/°C
Gate-Source Threshold Voltage (N) V
GS(th)
V
DS
= V
GS
, I
D
= 250 μA 3 - 5 V
Gate-Source Leakage I
GSS
V
GS
= ± 30 V - - ± 100 nA
Zero Gate Voltage Drain Current I
DSS
V
DS
= 400 V, V
GS
= 0 V - - 1
μA
V
DS
= 320 V, V
GS
= 0 V, T
J
= 125 °C - - 10
Drain-Source On-State Resistance R
DS(on)
V
GS
= 10 V I
D
= 13 A - 0.14 0.17
Forward Transconductance g
fs
V
DS
= 50 V, I
D
= 13 A - 7.4 - S
Dynamic
Input Capacitance C
iss
V
GS
= 0 V,
V
DS
= 100 V,
f = 1 MHz
- 1707 -
pF Output Capacitance C
oss
- 177 -
Reverse Transfer Capacitance C
rss
-19-
Total Gate Charge Q
g
V
GS
= 10 V I
D
= 13 A, V
DS
= 320 V
-4488
nC Gate-Source Charge Q
gs
-12-
Gate-Drain Charge Q
gd
-23-
Turn-On Delay Time t
d(on)
V
DD
= 320 V, I
D
= 13 A,
V
GS
= 10 V, R
g
= 24.6
-2142
ns
Rise Time t
r
-5786
Turn-Off Delay Time t
d(off)
-4080
Fall Time t
f
-3774
Gate Input Resistance R
g
f = 1 MHz, open drain - 1.8 -
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current I
S
MOSFET symbol
showing the
integral reverse
p - n junction diode
--24
A
Pulsed Diode Forward Current I
SM
--78
Diode Forward Voltage V
SD
T
J
= 25 °C, I
S
= 13 A, V
GS
= 0 V - - 1.2 V
Reverse Recovery Time t
rr
T
J
= 25 °C, I
F
= I
S
= 13 A,
dI/dt = 100 A/μs, V
R
= 20 V
- 353 - ns
Reverse Recovery Charge Q
rr
-4.4-μC
Reverse Recovery Current I
RRM
-24-A
S
D
G