Datasheet

Document Number: 62752
S12-1763-Rev. A, 23-Jul-12
www.vishay.com
7
Vishay Siliconix
Si8489EDB
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: [e-mail]
PACKAGE OUTLINE
MICRO FOOT: 4-BUMP (2 x 2, 0.5 mm PITCH)
Notes (Unless otherwise specified):
1. All dimensions are in millimeters.
2. Four (4) solder bumps are lead (Pb)-free 95.5Sn/3.8Ag/0.7Cu with diameter 0.30 mm to 0.32 mm.
3. Backside surface is coated with a Ti/Ni/Ag layer.
4. Non-solder mask defined copper landing pad.
5. •is location of pin 1.
Notes:
a. Use millimeters as the primary measurement.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?62752
.
S
D
G
S
XXX
8489
e
D
s
A2A1
A
s e
D
4 x Ø b
2
1
4
3
Recommended Land
e
Mark on Backside of Die
4 x Ø 0.24 to 0.26 Note 4
Solder Mask ~ Ø 0.25
Bump Note 2
Dim.
Millimeters
a
Inches
Min. Nom. Max. Min. Nom. Max.
A 0.462 0.505 0.548 0.0181 0.0198 0.0215
A
1
0.220 0.250 0.280 0.0086 0.0098 0.0110
A
2
0.242 0.255 0.268 0.0095 0.0100 0.0105
b 0.300 0.310 0.320 0.0118 0.0122 0.0126
e 0.500 0.0197
s 0.230 0.250 0.270 0.0090 0.0098 0.0106
D 0.920 0.960 1.000 0.0362 0.0378 0.0394