Datasheet

Si8487DB
www.vishay.com
Vishay Siliconix
S14-2452-Rev. D, 08-Dec-14
7
Document Number: 63483
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PACKAGE OUTLINE
MICRO FOOT: 4-BUMP (0.8 mm PITCH)
Notes (unless otherwise specified)
1. Laser mark on the silicon die back, coated with a thin metal.
2. Bumps are 95.5 Sn/3.8 Ag/0.7 Cu.
3. Non-solder mask defined copper landing pad.
4. The flat side of wafers is oriented at the bottom.
Note
a. Use millimeters as the primary measurement.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?63483
.
DIM.
MILLIMETERS
a
INCHES
MIN. MAX. MIN. MAX.
A 0.550 0.600 0.0216 0.0236
A1 0.260 0.290 0.0102 0.0114
A2 0.290 0.310 0.0114 0.0122
b 0.370 0.410 0.0146 0.0161
D 1.520 1.600 0.0598 0.0630
E 1.520 1.600 0.0598 0.0630
e 0.800 0.0315
S 0.360 0.400 0.0142 0.0157
Bump Note 2
8487
XXX
Recommended Land
Mark on Backside of Die
Silicon
4 x Ø 0.30 0.31
Note 3
Solder Mask Ø 0.40
b Diameter
e
e
A
A
2
A
1
e S
D
e
S
E
~
~