Datasheet

Vishay Siliconix
Si8424CDB
Document Number: 63894
S13-1703-Rev. B, 29-Jul-13
www.vishay.com
7
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: [e-mail]
PACKAGE OUTLINE
MICRO FOOT 1.6 x 1.6: 4-BUMP (0.8 mm PITCH)
Notes (Unless otherwise specified):
1. Laser mark on the silicon die back, coated with a thin metal.
2. Bumps are 95.5 Sn/3.8 Ag/0.7 Cu.
3. Non-solder mask defined copper landing pad.
4. The flat side of wafers is oriented at the bottom.
Notes:
a. Use millimeters as the primary measurement.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?63894
.
Dim.
Millimeters
a
Inches
Min. Max. Min. Max.
A 0.550 0.600 0.0216 0.0236
A
1
0.260 0.290 0.0102 0.0114
A
2
0.290 0.310 0.0114 0.0122
b 0.370 0.410 0.0146 0.0161
D 1.520 1.600 0.0598 0.0630
E 1.520 1.600 0.0598 0.0630
e 0.800 0.0315
S 0.360 0.400 0.0142 0.0157
Bump Note 2
8424C
XXX
Recommended Land
Mark on Backside of Die
Silicon
4 x Ø 0.30 0.31
Note 3
Solder Mask Ø 0.40
b Diamerter
e
e
A
A
2
A
1
e S
D
e
S
E
~
~