Datasheet

www.vishay.com
4
Document Number 71681
03-Mar-06
Vishay Siliconix
AN822
CONCLUSIONS
As a derivative of the PowerPAK SO-8, the PowerPAK
1212-8 uses the same packaging technology and has
been shown to have the same level of thermal perfor-
mance while having a footprint that is more than 40 %
smaller than the standard TSSOP-8.
Recommended PowerPAK 1212-8 land patterns are
provided to aid in PC board layout for designs using this
new package.
The PowerPAK 1212-8 combines small size with attrac-
tive thermal characteristics. By minimizing the thermal
rise above the board temperature, PowerPAK simplifies
thermal design considerations, allows the device to run
cooler, keeps r
DS(ON)
low, and permits the device to
handle more current than a same- or larger-size MOS-
FET die in the standard TSSOP-8 or SO-8 packages.
Figure 5. Spreading Copper - Si7401DN
45
55
65
75
85
95
105
0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00
R
AJht
(°C/W)
Spreading Copper (sq. in.)
100 %
50 %
0 %
Figure 6. Spreading Copper - Junction-to-Ambient Performance
R
AJ
(°C/W)
ht
50
60
70
80
90
100
110
120
130
0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00
Spreading Copper (sq. in.)
100 %
0 %
50 %