Datasheet

SFH618A, SFH6186
www.vishay.com
Vishay Semiconductors
Rev. 2.8, 29-Mar-18
9
Document Number: 83673
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SOLDER PROFILES
Fig. 17 - Recommended Wave Soldering Double Wave Profile
for DIP Devices
Fig. 18 - Recommended Lead (Pb)-free Reflow Solder Profile
for SMD Devices
HANDLING AND STORAGE CONDITIONS
ESD level: HBM class 2
Floor life: unlimited
Conditions: T
amb
< 30 °C, RH < 85 %
Moisture sensitivity level 1, according to J-STD-020
948626
10
100
1000
10000
0
100
200
300
0
50 100 150 200 250
Axis Title
1st line
2nd line
2nd line
Temperature (°C)
Time (s)
50
150
250
2 K/s
Second
wave
Wirst wave
5 s
Full line: typical
Dotted lines:
process limits
Lead temperature
235 °C to
260 °C
100 °C to
130 °C
ca. 200 K/s
Forced cooling
ca. 5 K/s
ca. 2 K/s
240 °C
Max. 260 °C
217 °C
255 °C
19841
10
100
1000
10000
0
100
200
300
0 50 100 150 200 300
Axis Title
1st line
2nd line
2nd line
Temperature (°C)
Time (s)
50
150
250
250
245 °C
Max. 100 s
Max. 30 s
Max. 120 s
Max. ramp down 6 °C/s
Max. ramp up 3 °C/s