Datasheet

RCV e3
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Vishay Draloric
Revision: 31-Jan-17
3
Document Number: 20054
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TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2
TEST METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
Stability for product types:
100 k to 10 M
RCV e3
4.5 - Resistance - ± 1 % ± 5 %
4.13 -
Short time
overload
U = 2.5 x
 2 x U
max.
;
± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )
Style Duration
RR2012M 1 s
RR3216M 2 s
4.17.2 58 (Td) Solderability
Solder bath method;
Sn60Pb40
non-activated flux;
(235 ± 5) °C
(2 ± 0.2) s
Good tinning
( 95 % covered);
no visible damage
Solder bath method;
Sn96.5Ag3Cu0.5
non-activated flux;
(245 ± 5) °C
(3 ± 0.3) s
Good tinning
( 95 % covered);
no visible damage
4.8.4.2 -
Temperature
coefficient
(20 / -55 / 20) °C and
(20 / 155 / 20) °C
± 100 ppm/K ± 200 ppm/K
4.32 21 (Uu
3
) Shear (adhesion) 17.7 N No visible damage
4.33 21 (Uu
1
) Substrate bending
Depth 2 mm;
3 times
No visible damage, no open circuit in bent position
± (0.25 % R + 0.05 )
4.19 14 (Na)
Rapid change of
temperature
30 min. at -55 °C;
30 min. at 125 °C
5 cycles ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )
1000 cycles ± (1 % R + 0.05 )± (1 % R + 0.05 )
4.23 - Climatic sequence: -
± (1 % R + 0.05 )± (2 % R + 0.1 )
4.23.2 2 (Ba) Dry heat 125 °C; 16 h
4.23.3 30 (Db) Damp heat, cyclic
55 °C;  90 % RH
24 h; 1 cycle
4.23.4 1 (Aa) Cold -55 °C; 2 h
4.23.5 13 (M) Low air pressure 1 kPa; (25 ± 10) °C; 1 h
4.23.6 30 (Db) Damp heat, cyclic
55 °C; . 90 % RH
24 h; 5 cycle
4.23.7 - DC load U =
4.25.1 -
Endurance
at 70 °C
U =  U
max.
;
1.5 h on; 0.5 h off;
70 °C; 1000 h ± (1 % R + 0.05 )± (2 % R + 0.1 )
70 °C; 8000 h ± (2 % R + 0.1 )± (4 % R + 0.1 )
4.18.2 58 (Td)
Resistance to
soldering heat
Solder bath method
(260 ± 5) °C;
(10 ± 1) s
± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )
4.24 78 (Cab)
Damp heat,
steady state
(40 ± 2) °C;
(93 ± 3) % RH;
56 days
± (1 % R + 0.05 )± (2 % R + 0.05 )
P
70
x R
P
70
x R
P
70
x R