Datasheet
NTCLE100E3
www.vishay.com
Vishay BCcomponents
Revision: 22-Dec-16
14
Document Number: 29049
For technical questions, contact: nlr@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKAGING
TAPE SPECIFICATIONS
DIMENSIONS in millimeters
DETAILS SYMBOL DIMENSIONS NOMINAL TOLERANCE REMARKS
Body diameter
Lead diameter
Feed hole diameter
D
d
D
0
3.3
0.6
4.0
± 0.5
± 0.06
± 0.2
5 max. for 3.3 to 220
Lead to lead distance F 2.5
+0.5
-0.2
Guaranteed between
component and tape
Distance component to tape centre
Component height
Component alignment
Distance top/bottom of components
Length of lacquer under the comp. bottom
H
H
1
h
H
2
H
3
22.0
32.2
0
6
2
± 1.0
max.
± 2.0
max.
± 1
1 to 4 max. for 3.3 to 220
Length of snipped lead L 11.0
max.
Pitch between thermistors
Feed hole pitch
Feed hole center to lead center
Component alignment
P
P
0
P
1
p
12.7
12.7
5.08
0
± 1.0
± 0.3
± 0.7
± 1.3
Cumulative pitch error
± 1 mm/20 pitches
guaranteed between
component and tape
Total thickness
Total tape thickness
T
t
3.0
0.9
max.
max.
4 max. for 3.3 to 220 with
cardboard tape 0.5 ± 0.1
Tape width
Hold down tape width
Hole position
Hold down tape position
W
W
0
W
1
W
2
18.0
5.0
9.0
1.5
± 1.0
- 0.5
± 0.3
± 0.5
± 1.0
None of the hold down tapes
may
cover the holes
P
A
P
D
D
0
L
H
W
0
W
2
W
1
W
P
0
P
1
F
Direction of unreeling
t
detail A
d
H
3
H
2
H
1
Taped according to IEC 60286-2
(cover tape may differ from shown)
T
H
1E pitch
NTCLE100E3...T1
Thermistors on tape