Datasheet

MSS1P3, MSS1P4
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Vishay General Semiconductor
Revision: 17-Jan-14
3
Document Number: 89019
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Fig. 5 - Typical Junction Capacitance Fig. 6 - Typical Transient Thermal Impedance
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
1000
100
10
0.1 1 10 100
Reverse Voltage (V)
Junction Capacitance (pF)
1000
100
10
1
0.10.01 1 10 100 1000
t - Pulse Duration (s)
Transient Thermal Impedance (°C/W)
Junction to Ambient
0.106 (2.70)
0.091 (2.30)
0.055 (1.40)
0.047 (1.20)
Cathode Band
MicroSMP
0.030 (0.75)
0.022 (0.55)
0.030 (0.75)
0.022 (0.55)
0.059 (1.50)
0.043 (1.10)
0.039 (0.98)
0.031 (0.78)
0.091 (2.30)
0.083 (2.10)
0.020 (0.50)
0.043
(1.10)
0.011 (0.27)
0.005 (0.12)
0.079
(2.00)
0.032
(0.80)
0.032
(0.80)
Mounting Pad Layout
0.029 (0.73)
0.025 (0.63)