Datasheet
IRF9640, SiHF9640
www.vishay.com
Vishay Siliconix
S16-0754-Rev. C, 02-May-16
4
Document Number: 91086
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 7 - Typical Source-Drain Diode Forward Voltage
Fig. 8 - Maximum Safe Operating Area
Fig. 9 - Maximum Drain Current vs. Case Temperature
Fig. 10a - Switching Time Test Circuit
Fig. 10b - Switching Time Waveforms
Fig. 11 - Maximum Effective Transient Thermal Impedance, Junction-to-Case
10
1
10
0
- V
SD
, Source-to-Drain Voltage (V)
- I
SD
, Reverse Drain Current (A)
1.0
5.0
4.0
3.02.0
25 °C
150 °C
V
GS
= 0 V
91086_07
10
-1
0.0
10 µs
100 µs
1 ms
10 ms
Operation in this area limited
by R
DS(on)
- V
DS
, Drain-to-Source Voltage (V)
- I
D
, Drain Current (A)
T
C
= 25 °C
T
J
= 150 °C
Single Pulse
10
2
2
5
1
2
5
10
25
110
25
10
2
10
3
25
91086_08
- I
D
, Drain Current (A)
T
C
, Case Temperature (°C)
0
4
6
8
10
12
91086_09
15025 125100
75
50
2
Pulse width ≤ 1 µs
Duty factor ≤ 0.1 %
R
D
V
GS
R
G
D.U.T.
- 10 V
+
-
V
DS
V
DD
V
GS
90 %
10 %
V
DS
t
d(on)
t
r
t
d(off)
t
f
10
1
0.1
10
-2
10
-5
10
-4
10
-3
10
-2
0.1 1 10
P
DM
t
1
t
2
t
1
, Rectangular Pulse Duration (s)
Thermal Response (Z
thJC
)
Notes:
1. Duty Factor, D = t
1
/t
2
2. Peak T
j
= P
DM
x Z
thJC
+ T
C
Single Pulse
(Thermal Response)
D = 0.50
0.20
0.05
0.02
0.01
91086_11
0.10