Datasheet

www.vishay.com Document Number: 91030
2 S11-1047-Rev. C, 30-May-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
IRF624S, SiHF624S
Vishay Siliconix
Note
a. When mounted on 1" square PCB (FR-4 or G-10 material).
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width 300 μs; duty cycle 2 %.
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL MIN. TYP. MAX. UNIT
Maximum Junction-to-Ambient
(PCB Mount)
a
R
thJA
--40
°C/W
Maximum Junction-to-Ambient R
thJA
--62
Maximum Junction-to-Case (Drain)
R
thJC
--2.5
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-Source Breakdown Voltage V
DS
V
GS
= 0, I
D
= 250 μA 250 - - V
V
DS
Temperature Coefficient
V
DS
/T
J
Reference to 25 °C, I
D
= 1 mA
-0.36-
V/°C
Gate-Source Threshold Voltage V
GS(th)
V
DS
= V
GS
, I
D
= 250 μA 2.0 - 4.0 V
Gate-Source Leakage I
GSS
V
GS
= ± 20 V - - ± 100 nA
Zero Gate Voltage Drain Current I
DSS
V
DS
= 250 V, V
GS
= 0 V - - 25
μA
V
DS
= 200V, V
GS
= 0 V, T
J
= 125 °C - - 250
Drain-Source On-State Resistance R
DS(on)
V
GS
= 10 V I
D
= 2.6 A
b
--1.1
Forward Transconductance g
fs
V
DS
= 50 V, I
D
= 2.6 A
b
1.5 - - S
Dynamic
Input Capacitance C
iss
V
GS
= 0 V,
V
DS
= 25 V,
f = 1.0 MHz, see fig. 5
-260-
pFOutput Capacitance C
oss
-77-
Reverse Transfer Capacitance C
rss
-15-
Total Gate Charge Q
g
V
GS
= 10 V
I
D
= 4.4 A, V
DS
= 200 V
see fig. 6 and 13
b
--14
nC Gate-Source Charge Q
gs
--2.7
Gate-Drain Charge Q
gd
--7.8
Turn-On Delay Time t
d(on)
V
DD
= 125 V, I
D
= 4.4 A
R
g
= 18 , R
D
= 28
see fig. 10
b
-7.0-
ns
Rise Time t
r
-13-
Turn-Off Delay Time t
d(off)
-20-
Fall Time t
f
-12-
Internal Drain Inductance L
D
Between lead,
6 mm (0.25") from
package and center of
die contact
-4.5-
nH
Internal Source Inductance L
S
-7.5-
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current I
S
MOSFET symbol
showing the
integral reverse
p - n junction diode
--4.4
A
Pulsed Diode Forward Current
a
I
SM
--14
Body Diode Voltage V
SD
T
J
= 25 °C, I
S
= 4.4 A, V
GS
= 0 V
b
--1.8V
Body Diode Reverse Recovery Time t
rr
T
J
= 25 °C, I
F
= 4.4 A,
dI/dt = 100 A/μs
b
- 200 400 ns
Body Diode Reverse Recovery Charge Q
rr
- 0.93 1.9 μC
Forward Turn-On Time t
on
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
and L
D
)
D
S
G
S
D
G