Datasheet

GI750, GI751, GI752, GI754, GI756, GI758
www.vishay.com
Vishay General Semiconductor
Revision: 01-Aug-13
3
Document Number: 88627
For technical questions within your region: [e-mail]
, [e-mail], [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 5 - Typical Reverse Characteristics Fig. 6 - Typical Transient Thermal Impedance
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
1
10
100
0.01
0.1
200 10040 60 80
Percent of Rated Peak Reverse Voltage (%)
Instantaneous Reverse Current (µA)
T
J
= 125 °C
T
J
= 25 °C
T
J
= 100 °C
10
100
0.1
1
0.01 0.1 1 10 100
t - Pulse Duration (s)
Transient Thermal Impedance (°C/W)
Mounted on
0.20" x 0.27" (5.0 mm x 7.0 mm)
Copper Pad Areas
0.052 (1.32)
0.048 (1.22)
0.360 (9.1)
0.340 (8.6)
DIA.
1.0 (25.4)
MIN.
0.360 (9.1)
0.340 (8.6)
1.0 (25.4)
MIN.
P600