Datasheet

GBPC12, GBPC15, GBPC25, GBPC35
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Vishay General Semiconductor
Revision: 21-Feb-14
4
Document Number: 88612
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Fig. 7 - Typical Junction Capacitance Per Diode Fig. 8 - Typical Transient Thermal Impedance Per Diode
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
1
10
100
10
100
1000
T
J
= 25 °C
f = 1.0 MHz
V
sig
= 50 mVp-p
Reverse Voltage (V)
Junction Capacitance (pF)
0.01
0.1
1
10
100
1
10
100
1000
T
J
= 25 °C
f = 1.0 MHz
V
sig
= 50 mVp-p
t - Heating Time (s)
Transient Thermal Impedance (°C/W)
1.135 (28.8)
1.115 (28.3)
0.732 (18.6)
0.692 (17.6)
0.470 (11.9)
0.430 (10.9)
0.042 (1.07)
0.038 (0.97)
DIA.
0.310 (7.87)
0.290 (7.36)
1.25
(31.8)
MIN.
1.135 (28.8)
1.115 (28.3)
0.732 (18.6)
0.692 (17.6)
Hole for
#10 Screw
0.220 (5.59)
0.200 (5.08)
DIA.
0.24 (6.0)
0.18 (4.6)
0.50 (12.7)
0.44 (11.7)
0.24 (6.0)
0.18 (4.6)
GBPC-W GBPC
1.135 (28.8)
1.115 (28.3)
0.672 (17.1)
0.632 (16.1)
0.732 (18.6)
0.692 (17.6)
0.094 (2.4)
DIA.
0.034 (0.86)
0.030 (0.76)
0.25
(6.35)
AC
0.840 (21.3)
0.740 (18.8)
0.582 (14.8)
0.542 (13.8)
0.672 (17.1)
0.632 (16.1)
1.135 (28.8)
1.115 (28.3)
0.310 (7.87)
0.290 (7.36)
0.034 (0.86)
0.030 (0.76)
Hole for
#10 Screw
0.220 (5.59)
0.200 (5.08)
DIA.