Datasheet

GBPC12, GBPC15, GBPC25, GBPC35
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Vishay General Semiconductor
Revision: 21-Feb-14
2
Document Number: 88612
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Notes
(1)
With heatsink
(2)
Bolt down on heatsink with silicone thermal compound between bridge and mounting surface for maximum heat transfer with #10 screw
ELECTRICAL CHARACTERISTICS (T
A
= 25 °C unless otherwise noted)
PARAMETER
TEST
CONDITIONS
SYMBOL
GBPC12, 15, 25, 35
UNIT
005 01 02 04 06 08 10
Maximum instantaneous
forward drop per diode
GBPC12 I
F
= 6.0 A
V
F
1.1 V
GBPC15 I
F
= 7.5 A
GBPC25 I
F
= 12.5 A
GBPC35 I
F
= 17.5 A
Maximum reverse DC current at rated
DC blocking voltage per diode
T
A
= 25 °C
I
R
5.0
μA
T
A
= 125 °C 500
Typical junction capacitance per diode 4 V, 1 MHz C
J
300 pF
THERMAL CHARACTERISTICS (T
A
= 25 °C unless otherwise noted)
PARAMETER SYMBOL
GBPC12, 15, 25, 35
UNIT
005 01 02 04 06 08 10
Typical thermal resistance
GBPC12 to GBPC25
R
JC
(1)
1.9
°C/W
GBPC35 1.4
ORDERING INFORMATION (Example)
PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE
GBPC1206-E4/51 15.79 51 100 Paper box
GBPC1506-E4/51 15.79 51 100 Paper box
GBPC2506-E4/51 15.79 51 100 Paper box
GBPC3506-E4/51 15.79 51 100 Paper box
GBPC1206W-E4/51 13.8 51 100 Paper box
GBPC1506W-E4/51 13.8 51 100 Paper box
GBPC2506W-E4/51 13.8 51 100 Paper box
GBPC3506W-E4/51 13.8 51 100 Paper box