Datasheet

EGF1T
www.vishay.com
Vishay General Semiconductor
Revision: 16-Aug-13
2
Document Number: 88904
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Notes
(1)
Pulse test: 300 μs pulse width, 1 % duty cycle
(2)
Pulse test: Pulse width 40 ms
Note
(1)
Thermal resistance from junction to ambient and from junction to lead, PCB mounted on 0.95" x 0.95" (24 mm x 24 mm) copper pad areas
Note
(1)
AEC-Q101 qualified
RATINGS AND CHARACTERISTICS CURVES (T
A
= 25 °C unless otherwise noted)
Fig. 1 - Maximum Forward Current Derating Curve Fig. 2 - Maximum Non-Repetitive Forward Surge Current
ELECTRICAL CHARACTERISTICS (T
A
= 25 °C unless otherwise noted)
PARAMETER TEST CONDITIONS SYMBOL EGF1T UNIT
Maximum instantaneous forward voltage 1.0 A T
J
= 25 °C V
F
(1)
3.0 V
Maximum DC reverse current V
RM
T
J
= 25 °C
I
R
(2)
5.0
μA
T
J
= 125 °C 50
Typical reverse recovery time
I
F
= 0.5 A, I
R
=1.0 A,
I
rr
= 0.25 A
t
rr
75 ns
Typical junction capacitance 4.0 V, 1 MHz C
J
8.0 pF
THERMAL CHARACTERISTICS (T
A
= 25 °C unless otherwise noted)
PARAMETER SYMBOL EGF1T UNIT
Typical thermal resistance
R
JA
(1)
50
°C/W
R
JL
(1)
20
ORDERING INFORMATION (Example)
PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE
EGF1T-E3/67A 0.104 67A 1500 7" diameter plastic tape and reel
EGF1T-E3/5CA 0.104 5CA 6500 13" diameter plastic tape and reel
EGF1THE3/67A
(1)
0.104 67A 1500 7" diameter plastic tape and reel
EGF1THE3/5CA
(1)
0.104 5CA 6500 13" diameter plastic tape and reel
0
1.5
25 50 75 100 125 150 175
Average Forward Current (A)
0.5
1.0
T
L
- Lead Temperature (°C)
Forward Surge Current (A)
25
20
15
10
5
0
110
100
Number of Cycles