Datasheet

DTO25
www.vishay.com
Vishay Sfernice
Revision: 23-Oct-2019
2
Document Number: 51054
For technical questions, contact: sferfixedresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
DIMENSIONS
Standard Package TO-252 style (DPAK)
SPECIAL FEATURES
Resistance Values 0.016 0.1 0.5
Requirement Temperature Coefficient (TCR)
(-55 °C +150 °C) IEC 60115-1
± 900 ppm/°C ± 350 ppm/°C ± 150 ppm/°C
PERFORMANCE
TESTS CONDITIONS REQUIREMENTS
Momentary Overload
IEC 60115-1 §4.13
1.6 Pr 5 s
US < 1.5 UL
± (0.25 % + 0.005 )
Load Life
IEC 60115-1
1000 h, 90/30 Pr at +25 °C
± (1 % + 0.005 )
High Temperature Exposure
AEC-Q200 rev. D conditions:
MIL-STD-202 method 108
1000 h, +175 °C, unpowered
± (1 % + 0.005 )
Temperature Cycling
AEC-Q200 rev. D conditions:
pre-conditioning 3 reflows according
JESTD020D
JESD22 method JA-104
1000 cycles, (-55 °C to +125 °C)
dwell time 15 min
± (0.5 % + 0.005 )
Biased Humidity
AEC-Q200 rev. D conditions:
MIL-STD-202 method 103
1000 h, 85°C, 85 % RH
± (0.5 % + 0.005 )
Operational Life
AEC-Q200 rev. D conditions:
pre-conditioning 3 reflows according
JESTD020D
MIL-STD-202 method 108
1000 h, 90/30, powered, +125 °C
± (1 % + 0.005 )
ESD Human Body Model
AEC-Q200 rev. D conditions:
AEC-Q200-002
25 kV
AD
± (0.5 % + 0.005 )
Vibration
AEC-Q200 rev. D conditions:
MIL-STD-202 method 204
20 g’s for 20 min, 12 cycles
test from 10 Hz to 2000 Hz
± (0.5 % + 0.005 )
Mechanical Shock
AEC-Q200 rev. D conditions:
MIL-STD-202 method 213
100 g’s, 6 ms, 3.75 m/s
3 shocks/direction
± (0.5 % + 0.005 )
Board Flex
AEC-Q200 rev. D conditions:
AEC-Q200-005
bending 2 mm, 60 s
± (0.25 % + 0.01 )
Terminal Strength
AEC-Q200 rev. D conditions:
AEC-Q200-006
1.8 kgf, 60 s
± (0.25 % + 0.01 )
ASSEMBLY SPECIFICATIONS
For the assembly on board, we recommend the lead (Pb)-free thermal profile as per J-STD-020C
TESTS CONDITIONS REQUIREMENTS
Resistance to Soldering Heat
AEC-Q200 REV D
MIL-STD-202 method 210
Solder Bath method: 270 °C / 10 s
± (0.5 % + 0.005 )
Moisture Sensitivity Level (MSL)
IPC / JEDEC
®
J-STD-020C
85 °C / 85 % RH / 168 h
Level: 1
+ pass requirements of TCR
Overload and Dielectic Strength after MSL