Datasheet

DF005S, DF01S, DF02S, DF04S, DF06S, DF08S, DF10S
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Vishay General Semiconductor
Revision: 19-Aug-13
3
Document Number: 88573
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Fig. 5 - Typical Junction Capacitance Per Diode Fig. 6 - Typical Transient Thermal Impedance

PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
1
10
100
1
10
100
Reverse Voltage (V)
Junction Capacitance (pF)
T
J
= 25 °C
f = 1.0 MHz
V
sig
= 50 mVp-p
0.01
0.1
1
10
100
0.1
1
10
100
t - Heating Time (s)
Transient Thermal Impedance (°C/W)
Mounting Pad Layout
0.255 (6.5)
0.245 (6.2)
0.013 (0.330)
0.009 (0.241)
0.060 (1.524)
0.040 (1.016)
0.404 (10.3)
0.013 (0.330)
0.003 (0.076)
0.047 (1.20)
0.040 (1.02)
0.205 (5.2)
0.195 (5.0)
0.335 (8.51)
0.320 (8.13)
0.130 (3.3)
0.120 (3.05)
45°
0.386 (9.80)
Case Style DFS
0.404 MAX.
(10.26 MAX.)
0.205 (5.2)
0.195 (5.0)
0.047 MIN.
(1.20 MIN.)
0.060 MIN.
(1.52 MIN.)