Datasheet

CRHV
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Vishay Techno
Revision: 18-Apr-17
3
Document Number: 68002
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Notes
(1)
Use solder termination N for applications requiring epoxy bondable mounting, and solder terminations F or S for applications requiring
solderable mounting
(2)
While not recommended, palladium silver terminations could be used for solderable applications when using a solder alloy containing silver.
If the solder paste being used to solder the palladium silver terminated parts to the boards does not have a silver-based composition, then
the silver in the terminations could begin to leach when it is exposed to liquidus non-silver-based solders, causing the potential for
solderability and/or solder joint issues
(3)
Standard solder plating for the nickel barrier and non-magnetic parts is solder terminations E or T. Hot solder dipped terminations F or S are
also available
Note
• This summary is based on testing done on values up to 2 G
DIMENSIONS in inches (millimeters)
MODEL
LENGTH (L)
± 0.006 (0.152)
WIDTH (W)
± 0.006 (0.152)
THICKNESS (T)
± 0.002 (0.051)
CRHV1206 0.125 0.063 0.025
CRHV1210 0.125 0.100 0.025
CRHV2010 0.200 0.100 0.025
CRHV2510 0.250 0.100 0.025
CRHV2512 0.250 0.126 0.025
TYPE
TERMINATION
MATERIAL
TERMINATION
STYLE
TERMINATION STYLE/
MATERIAL CODE
SOLDER TERMINATION
CODE
Solderable
Nickel barrier
3-sided (wraparound) AF
E or T (standard);
F or S (optional)
(3)
Top only (flip chip) BF
5-sided (wraparound) CF
Non-magnetic
3-sided (wraparound) AG
E or T (standard);
F or S (optional)
(3)
Top only (flip chip) BG
Epoxy bondable/
solderable
Platinum palladium gold
3-sided (wraparound) AE
N (standard);
F or S (optional)
(1)
Top only (flip chip) BE
5-sided (wraparound) CE
Wire bondable/
Epoxy bondable
Gold
3-sided (wraparound) AC
NTop only (flip chip) BC
5-sided (wraparound) CC
Epoxy bondable
Palladium silver
(2)
3-sided (wraparound) AA
N
Top only (flip chip) BA
5-sided (wraparound) CA
Platinum gold
3-sided (wraparound) AB
Top only (flip chip) BB
5-sided (wraparound) CB
Platinum silver
3-sided (wraparound) AD
Top only (flip chip) BD
5-sided (wraparound) CD
PERFORMANCE
TEST CONDITIONS OF TEST
TEST RESULTS
(TYPICAL TEST LOTS)
Life MIL-STD-202, method 108, 1000 h rated power at +70 °C ± 0.5 %
High temperature exposure MIL-STD-202, method 108 ± 0.2 %
Low temperature operation MIL-PRF-55342, paragraph 4.8.5 ± 0.05 %
Resistance to bonding exposure MIL-STD-202, methods 210 ± 0.1 %
Moisture resistance MIL-PRF-55342, paragraph 4.8.9 ± 0.06%
Solder mounting integrity MIL-PRF-55342, paragraph 4.8.13, 2 kg for 30 s No evidence of mechanical damage
Solderability MIL-STD-202, method 208 95 % coverage
0.025 [0.635]
Max.
L
T
W
Termination Style A 
(3-sided wraparound)
0.025 [0.635]
Max.
W
T
L
Termination Style B
(Top conductor only)
T
W
L
0.025 [0.635]
Max.
Termination Style C
(5-sided wraparound)