Datasheet

Document Number: 20035 For technical questions, contact: thickfilmchip@vishay.com
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Revision: 04-Jun-12 131
D/CRCW e3
Standard Thick Film Chip Resistors
Vishay
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All tests are carried out in accordance with the following specifications:
EN 60115-1, generic specification
EN 140400, sectional specification
EN 140401-802, detail specification
IEC 60068-2-x, environmental test procedures
Packaging of components is done in paper or blister tapes according to IEC 60286-3.
4.18.2 58 (Td)
Resistance to
soldering heat
Solder bath method
(260 ± 5) C;
(10 ± 1) s
± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )
4.35 -
Flamability,
needle flame test
IEC 60695-11-5;
10 s
No burning after 30 s
4.24 78 (Cab)
Damp heat,
steady state
(40 ± 2) °C;
(93 ± 3) % RH;
56 days
± (1 % R + 0.05 )
4.25.3 -
Endurance at
upper category
temperature
155 °C, 1000 h ± (1 % R + 0.05 (2 % R + 0.1 )
4.40 -
Electrostatic
discharge
(human body model)
IEC 61340-3-1;
3 pos. + 3 neg.
discharges;
ESD voltage acc. to size
± (1 % R + 0.05 )
4.29 45 (XA)
Component solvent
resistance
Isopropyl alcohol;
50 °C; method 2
No visible damage
4.30 45 (XA)
Solvent resistance
of marking
Isopropyl alcohol;
50 °C; method 1,
toothbrush
Marking legible,
no visible damage
4.22 6 (Fc)
Vibration, endurance
by sweeping
f = 10 Hz to 2000 Hz;
x, y, z 1.5 mm;
A 200 m/s
2
;
10 sweeps per axis
± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )
4.37 -
Periodic electric
overload
U =
2 x U
max.
;
0.1 s on; 2.5 s off;
1000 cycles
± (1 % R + 0.05 )
4.27 -
Single pulse high
voltage overload,
10 µs/700 µs
Û = 10 x
2 x U
max.
;
10 pulses
± (1 % R + 0.05 )
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
SIZE 0402 to 2512
STABILITY
CLASS 1
OR BETTER
STABILITY
CLASS 2
OR BETTER
Stability for product types:
D/CRCW e3 1 to 10 M
P
70
x R