Datasheet

BZT03-Series
www.vishay.com
Vishay Semiconductors
Rev. 1.6, 29-Nov-11
4
Document Number: 85599
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BASIC CHARACTERISTICS (T
amb
= 25 °C, unless otherwise specified)
Fig. 1 - Epoxy Glass Hard Tissue, Board Thickness 1.5 mm,
R
thJA
≤ 100 K/W
Fig. 2 - Total Power Dissipation vs. Ambient Temperature
Fig. 3 - Forward Current vs. Forward Voltage
Fig. 4 - Non Repetitive Surge Power Dissipation vs.
Pulse Length
PACKAGE DIMENSIONS in millimeters (inches): SOD-57
25
50 3
2
50
7
94 9086a
0
0
1
2
3
4
94 9584
40 80 120 160
P –Total Power Dissipation ( W )
tot
T
amb
–Ambient Temperature ( °C )
200
ll
T
L
=constant
l=10mm
see Fig.1
15mm
20mm
0 0.5 1.0 1.5
0
0.5
1.0
1.5
2.0
3.0
2.0
94 9585
I–Forward Current (A )
F
V
F
–Forward Voltage ( V )
2.5
T
j
=25°C
0.01 0.1 1 10
10
100
1000
10000
P–Non-RepetitiveSurge Power
ZSM
t
p
–Pulse Length ( ms )
100
94 9586
Dissipation (W )
T
j
=25°C
20543
3.6 (0.142) max.
26 (1.024) min.
4 (0.157) max.
26 (1.024) min.
0.82 (0.032) max.