Datasheet

BZM55-Series
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Vishay Semiconductors
Rev. 2.1, 25-Nov-11
6
Document Number: 85597
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Fig. 13 - Thermal Response
PACKAGE DIMENSIONS in millimeters (inches): MicroMELF
1
10
100
1000
Z
thp
- Thermal Resistance for Pulse Cond. (KW)
t
p
- Pulse Length (ms)
95 9603
10
-1
10
0
10
1
10
2
t
p
/T = 0.5
t
p
/T = 0.2
t
p
/T = 0.1
t
p
/T = 0.05
t
p
/T = 0.02
t
p
/T = 0.01
Single Pulse
R
thJA
= 300 K/W
T = T
jmax
- T
amb
i
ZM
= (- V
Z
+ (V
Z
2
+ 4r
zj
x T/Z
thp
)
1/2
)/(2r
zj
)
Cathode indification
surface plan1 (0.039)
glass
glass
surface plan
2 (0.079)
1.8 (0.071)
0.25 (0.010)
0.15 (0.006)
1.2 (0.047) 1.1 (0.043)
> R2.5 (0.098)
< 1.35 (0.053)
0.6 (0.024)
Foot print recommendation:
Reflow soldering Wave soldering
2.4 (0.094) 2.8 (0.110)
0.8 (0.031)0.8 (0.031) 0.9 (0.035) 0.9 (0.035)
1.2 (0.047)
0.8 (0.031)
1.4 (0.055)
1 (0.039)
Document no.:6.560-5007.01-4
Rev. 13 - Date: 07.June.2006
96 12072
Created - Date: 26.July.1996
*
*
The gap between plug and glass can
be either on cathode or anode side