Datasheet

BZG03C-Series
www.vishay.com
Vishay Semiconductors
Rev. 2.0, 23-Apr-14
3
Document Number: 85593
For technical questions within your region: [e-mail]
, [e-mail], [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
BASIC CHARACTERISTICS (T
amb
= 25 °C, unless otherwise specified)
Fig. 1 - Boards for R
thJA
Definition (Copper Overlay 35 µ)
Fig. 2 - Total Power Dissipation vs. Ambient Temperature
Fig. 3 - Forward Current vs. Forward Voltage
Fig. 4 - Non Repetitive Surge Power Dissipation vs.
Pulse Length
Fig. 5 - Thermal Response
2
1.5
25
25
2
10
1
5
94 9313
a) b)
0
0
0.5
1
1.5
2
2.5
3
3.5
94 9580
25 50 75 100 125
P
tot
- Total Power Dissipation (W)
T
amb
- Ambient Temperature (°C)
150
R
thJA
= 100 K/W
R
thJA
= 25 K/W
0 0.5 1.0 1.5
0
0.5
1.0
1.5
2.0
3.0
2.0
94 9581
I
F
- Forward Current (A)
V
F
- Forward Voltage (V)
2.5
0.01 0.1 1 10
10
100
1000
10 000
P
ZSM
- Non-Repetitive Surge Power
Dissipation (W)
t
p
- Pulse Length (ms)
100
94 9582
1
10
100
1000
Z
thp
- Thermal Resistance for Pulse Cond. (K/W)
t
p
- Pulse Length (s)
94 9583
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
t
p
/T = 0.5
t
p
/T = 0.2
t
p
/T = 0.1
t
p
/T = 0.05
t
p
/T = 0.02
t
p
/T = 0.01