Datasheet

BYS10-25 thru BYS10-45
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Vishay General Semiconductor
Revision: 26-Mar-12
3
Document Number: 86013
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Fig. 3 - Max. Average Forward Current vs. Ambient Temperature
Fig. 4 - Max. Average Forward Current vs. Ambient Temperature
Fig. 5 - Max. Forward Current vs. Forward Voltage
Fig. 6 - Typical Transient Thermal Impedance
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
0
0
0.4
0.8
1.2
1.6
2.0
40 80 120 160
200
BYS10-25
BYS10-35
BYS10-45
Ambient Temperature (°C)
Average Forward Cu
rrent (A)
V
R
= V
RRM
, Half Sine-Wave, R
thJA
= 25 K/W
0
0
0.4
0.8
1.2
1.6
2.0
40 80 120 160
200
100 K/W
125 K/W
150 K/W
Ambient Temperature (°C)
Average Forward Cu
rrent (A)
V
R
= 0 V, Half Sine-Wave
R
thJA
= 25 K/W
0 0.4 0.
8 1.2 1.6
0.01
0.1
1
10
100
2.0
T
J
= 150 °C
T
J
= 25 °C
Forward Voltage (V)
Forward Current (A)
0.01
0.1
1
10
100
0.1
1
10
100
t - Heating Time (s)
Transient Thermal Impedance (°C/W)
0.008 (0.203)
0.194 (4.93)
0.208 (5.28)
0.157 (3.99)
0.177 (4.50)
0.100 (2.54)
0.110 (2.79)
0.078 (1.98)
0.090 (2.29)
0.006 (0.152)
0.012 (0.305)
0.049 (1.25)
0.065 (1.65)
Cathode Band
0 (0)
DO-214AC (SMA)
Mounting Pad Layout
0.074 (1.88)
MAX.
0.208 (5.28)
REF.
0.066 (1.68)
MIN.
0.060 (1.52)
MIN.
0.030 (0.76)
0.060 (1.52)