Datasheet

BYM12-xxx, EGL41x
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Vishay General Semiconductor
Revision: 11-Dec-13
3
Document Number: 88581
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Fig. 3 - Typical Instantaneous Forward Characteristics
Fig. 4 - Typical Reverse Leakage Characteristics
Fig. 5 - Typical Junction Capacitance
Fig. 6 - Typical Transient Thermal Impedance

PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
0.40.2 0.6 0.8 1.0 1.2 1.4 1.6
0.01
0.1
10
1
50
1.8
T
J
= 150 °C
T
J
= 25 °C
Pulse Width = 300 µs
1 % Duty Cycle
Instantaneous Forward Voltage (V)
Instantaneous Forward Current (A)
EGL41A thru EGL41D
EGL41F thru EGL41G
6040200 10080
0.01
0.1
10
1
100
1000
T
J
= 100 °C
T
J
= 150 °C
T
J
= 25 °C
Percent of Rated Peak Reverse Voltage (%)
Instantaneous Reverse Leakage
Current (µA)
Reverse Voltage (V)
Junction Capacitance (pF)
0.1 101 100
20
10
30
40
50
60
70
0
EGL41A thru EGL41D
EGL41F thru EGL41G
T
J
= 25 °C
f = 1.0 MHz
V
sig
= 50 mV
p-p
0.01 0.1 101 100
100
10
1
0.1
t - Pulse Duration (s)
Transient Thermal Impedance (°C/W)
D1 =
0.105
0.095
(2.67)
(2.41)
+ 0
- 0.008 (0.20)
D2
DO-213AB (GL41)
Solderable Ends
1
st
Band
D2 = D1
1
st
Band Denotes Type and Positive End (Cathode)
0.138 (3.5)
MAX.
0.049 (1.25)
MIN.
0.118 (3.0)
MIN.
0.238 (6.0)
REF.
Mounting Pad Layout
0.022 (0.56)
0.018 (0.46)
0.022 (0.56)
0.018 (0.46)
0.205 (5.2)
0.185 (4.7)