Datasheet

BFC2 808 .....
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Vishay BCcomponents
Revision: 04-Aug-15
4
Document Number: 28527
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SOLDERING CONDITIONS
For general soldering conditions and wave soldering profile, we refer to the application note “Soldering Guidelines for Film
Capacitors”: www.vishay.com/doc?28171
TEST PROCEDURES AND REQUIREMENTS
IEC
60418-1
CLAUSE
IEC 60068
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
4.2 Method of mounting Method A
14 Capacitance drift After TC measurement C/C:  1 % for C
max.
< 40pF;
C/C:  2.5 % for C
max.
 40pF
19 Thrust Axial thrust of 2N C/C:  0.3 %
21 Robustness of terminations:
21.1 Ua Tensile 1N No damage
21.2 Ub Bending 1 cycle No damage
22 Na Rapid change of temperature 1 cycle; 0.5 h at lower and 0.5 h
at upper category temperature
C/C:  2 %
23 T Soldering:
Ta Solderability Solder bath immersion 3mm;
235°C;2s
Good wetting,
no mechanical damage
Tb Resistance to heat Solder bath: 260°C;10s No mechanical damage
24 Eb Impact bump 4000 ± 10bumps; 40g;6ms C/C:  0.6 %;
no mechanical damage
25 Fc Vibration Frequency 10Hz to55Hz;
amplitude 0.35mm;
1.5 h
C/C:  0.6 %;
no mechanical damage
26 Climatic sequence: C/C:  4 %
26.1 B Dry heat 16h at upper category
temperature
tan :  10 x 10
-4
for C
max.
< 27pF;
tan :  70 x 10
-4
for C
max.
 27pF;
tan :  80 x 10
-4
for C
max.
 40pF

R
ins.
:  10 000M;
rotor contact R:  10m
26.2 D Damp heat accelerated,
first cycle
1 cycle; 24 h; +40 °C;
95% to100 % RH
Voltage proof:
500V for 1min
26.3 Aa Cold 16h; -40 °C Visual examination:
no mechanical damage
26.5 Damp heat accelerated,
remaining cycles
1 cycle; 24 h; +40 °C; 
95 % to 100 % RH
Operating torque: 
1mNm to15mNm for C
max.
< 33pF;
1mNm to25mNm for C
max.
 33pF