Datasheet

MKT371, MKT372, MKT373
Vishay BCcomponents
DC Film Capacitors
MKT Radial Potted Type
www.vishay.com For technical questions, contact: [e-mail]
Document Number: 28109
116 Revision: 22-Dec-10
HEAT CONDUCTIVITY (G) AS A FUNCTION OF (ORIGINAL) PITCH AND CAPACITOR BODY
THICKNESS IN mW/°C
POWER DISSIPATION AND MAXIMUM COMPONENT TEMPERATURE RISE
The power dissipation must be limited in order not to exceed the maximum allowed component temperature rise as a function of
the free ambient temperature.
The power dissipation can be calculated according type detail specification “HQN-384-01/101: Technical Information Film
Capacitors”.
The component temperature rise (ΔT) can be measured (see section “Measuring the component temperature” for more details)
or calculated by ΔT = P/G:
• ΔT = Component temperature rise (°C)
• P = Power dissipation of the component (mW)
• G = Heat conductivity of the component (mW/°C)
MEASURING THE COMPONENT TEMPERATURE
A thermocouple must be attached to the capacitor body as in:
The temperature is measured in unloaded (T
amb
) and maximum loaded condition (T
C
).
The temperature rise is given by ΔT = T
C
- T
amb
.
To avoid radiation or convection, the capacitor should be tested in a wind-free box.
W
max.
(mm)
HEAT CONDUCTIVITY (mW/°C)
PITCH 7.62 mm PITCH 10.0 mm PITCH 15.0 mm PITCH 22.5 mm PITCH 27.5 mm
2.53----
3.04----
3.5-----
4.056.0---
4.5-----
5.0 6 7.5 10 - -
6.0 7 9.0 11 19 -
7.0 - - 12 21 -
8.5 - - 16 25 -
10.0 - - 18 28 -
11.0----36
13.0----42
15.0----48
18.0----57
Thermocouple