Datasheet

BAS70-00 to BAS70-06
www.vishay.com
Vishay Semiconductors
Rev. 2.0, 25-Feb-13
2
Document Number: 85702
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Note
(1)
Pulse test; t
p
 300 μs
LAYOUT FOR R
thJA
TEST
Thickness:
Fiberglass 1.5 mm (0.059")
Copper leads 0.3 mm (0.012")
PACKAGE DIMENSIONS in millimeters (inches): SOT-23
ELECTRICAL CHARACTERISTICS (T
amb
= 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT
Reserve beakdown voltage I
R
= 10 μA (pulsed) V
(BR)
70 V
Leakage current V
R
= 50 V I
R
20 100 nA
Forward voltage I
F
= 1.0 mA V
F
410 mV
Forward voltage
(1)
I
F
= 15 mA V
F
1000 mV
Diode capacitance V
R
= 0 V, f = 1 MHz C
D
1.5 2 pF
Reserve recovery time
I
F
= I
R
= 10 mA, i
R
= 1 mA,
R
L
= 100 
t
rr
5ns
17451
15 (0.59)
12 (0.47)
0.8 (0.03)
5 (0.2)
7.5 (0.3)
3 (0.12)
1 (0.4)
1 (0.4)
2 (0.8)
2 (0.8)
1.5 (0.06)
5.1 (0.2)
Foot print recommendation:
Rev. 8 - Date: 23.Sept.2009
17418
Document no.: 6.541-5014.01-4
0.9 (0.035)
1 (0.039)
0.9 (0.035)
1 (0.039)
1.43 (0.056)
0.45 (0.018)
0.35 (0.014)
2.8 (0.110)
3.1 (0.122)
0.45 (0.018)
0.35 (0.014)
0.45 (0.018)
0.35 (0.014)
0.1 (0.004) max.
2.35 (0.093)
2.6 (0.102)
0.175 (0.007)
0.098 (0.004)
1.15 (0.045)
0.9 (0.035)
1.20 (0.047)
0.95 (0.037) 0.95 (0.037)
2 (0.079)
0.7 (0.028)
0.9 (0.035)
0° to 8°
0.2 (0.008)
0.3 (0.012)
0.5 (0.020)
0.550 ref. (0.022 ref.)