Service manual
Table Of Contents
- VP171sb-1.pdf
- VP171 Series Service Manual
- Preface
- Table of Contents
- Chapter 1 Introduction
- Chapter 2 Mechanical Construction
- Chapter 3 Procedure of Disassembly
- Chapter 4 Troubleshooting Procedure
- Chapter 5 RMA Inspection Standard
- Chapter 6 Function Test and Alignment Procedure
- Chapter 7 Firmware Upgrade Procedure
- Chapter 8 DDC Key In Procedure
- Chapter 9 Panel Specification
- Chapter 10 Packing For Shipping
- Chapter 11 Appendix
- VP171sb-1.pdf
- Preface
- Flowchart for Repair
- Table of Contents
- Chapter 1 Introduction
- Chapter 2 Mechanical Construction
- Chapter 3 Procedure of Disassembly
- Chapter 4 Troubleshooting Procedure
- Chapter 5 RMA Inspection Standard
- Chapter 6 Function Test and Alignment Procedure
- Chapter 7 Firmware Upgrade Procedure
- Chapter 8 DDC Key-In Procedure
- Chapter 9 Panel Specification
- Chapter 10 Packing For Shipping
- Chapter 11 Appendix
- Reader's Response
- VP171 -page 11 only.pdf
- VP171 Series Service Manual
- Preface
- Table of Contents
- Chapter 1 Introduction
- Chapter 2 Mechanical Construction
- Chapter 3 Procedure of Disassembly
- Chapter 4 Troubleshooting Procedure
- Chapter 5 RMA Inspection Standard
- Chapter 6 Function Test and Alignment Procedure
- Chapter 7 Firmware Upgrade Procedure
- Chapter 8 DDC Key In Procedure
- Chapter 9 Panel Specification
- Chapter 10 Packing For Shipping
- Chapter 11 Appendix
- VP171 -page 11 only.pdf
- VP171 Series Service Manual
- Preface
- Table of Contents
- Chapter 1 Introduction
- Chapter 2 Mechanical Construction
- Chapter 3 Procedure of Disassembly
- Chapter 4 Troubleshooting Procedure
- Chapter 5 RMA Inspection Standard
- Chapter 6 Function Test and Alignment Procedure
- Chapter 7 Firmware Upgrade Procedure
- Chapter 8 DDC Key In Procedure
- Chapter 9 Panel Specification
- Chapter 10 Packing For Shipping
- Chapter 11 Appendix
- VP171 -page 11 only.pdf
- VP171 Series Service Manual
- Preface
- Table of Contents
- Chapter 1 Introduction
- Chapter 2 Mechanical Construction
- Chapter 3 Procedure of Disassembly
- Chapter 4 Troubleshooting Procedure
- Chapter 5 RMA Inspection Standard
- Chapter 6 Function Test and Alignment Procedure
- Chapter 7 Firmware Upgrade Procedure
- Chapter 8 DDC Key In Procedure
- Chapter 9 Panel Specification
- Chapter 10 Packing For Shipping
- Chapter 11 Appendix

5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
5V_MAIN=2.5A
3.3V_MAIN MAX 5A
(GM5120)
(GM5120)
(GM5120)
Close to GM5120
B
2
C
3
E
1
Debug
NC
0805
LESR
08050805
VP171/s/b
Monday, April 14, 2003
POWER
Title
Size Document Number
Rev
Date:
Sheet
+12VA
BRI
ON
BLON3
PNL_EN3
BRIGHT3
+5V
+3.3VD
+2.5VD
2.5V_VDD
2.5V_AVDD
3.3V_AVDD
+3.3VA
3.3V_DVDD
+5V
+12VA
+12VA
+5V
+3.3VA
VPL
+5V
+5V
+3.3VD
+5VIN
+12VIN
+2.5VD
+5V
+12VA
GND
+12VA
+12V
C43
0.1uF
SOT
23
D
G
S
MOSN
N
Q1
AO3400
Power NMOS
NMos
1
3
2
C18
0.1u
C16
100uF/16V
C17
0.1u
C10
2200uF/16V
C7
0.1uF
JP2
BNC-2
2
3
1
C11
0.1uF
C6
470uF/16V
R3
4.7K
C51
0.1uF
C38
100uF/16V
C15
100uF/16V
C53
NC
R2
NC
C8
0.1uF
C21
10k
R5
1K
C20
NC
L6 BEAD 0805
R8
330/1%
C23
0.1uF
C24
0.1uF
C31
0.1uF
C13
NC
C3
0.1uF
C29
0.1uF
C30
1000uF/10V
L3 150uH
C47
0.1uF
R4
330/1%
C2
0.1uF
R7
200/1%
C1
100uF/16V
R1
330/1%
D1
IN5822
L5 22uH
L8 22uH
C34
0.1uF
C4
100uF/16V
R6 0
R14
NC
C28
0.1uF
U4 AP1501
1 2
4
5
3
+VIN VOUT
VOS
S.S
GND
C39
0.1uF
JP1
HEADER 10-2.0
1
2
3
4
5
6
7
8
9
10
U3
AIC1084
3 1
2
VIN VOUT
GND
C22
100uF/16V
Q2
2N3904
1
2
3
R10
100K
C12
0.1uF
C25
100uF/16V
C44
1000uF/10V
C45
0.1uF
L11 BEAD /0805
C48
0.1uF
L4 22uH
R11
750R
L9 BEAD /0805
L10 BEAD /1206
U2
XC6201
3 1
2
VI VO
GND
R13
33
L1 22uH
C19
100uF/16V
C27
100uF/16V
C49
NC
C14
NC
R9
100K
C5
0.1uF
C35
0.1uF
U1
AIC1084
3 1
2
VIN VOUT
GND
C46
0.1uF
C40
0.1uF
C41
0.1uF
C33
0
C36
0.1uF
CN1
TU2001WNR-5P
1
2
3
4
C52
NC
Q3
2N3904
1
2
3
C176
0.1uF
R12
10K
C42
0.1uF
C54
NC
C50
NC
!
!
ViewSonic Corporation
68
Confidential – Do Not Copy
VP171/s/b-1
11. Schematic Diagram