Service manual
Table Of Contents
- VP171sb-1.pdf
- VP171 Series Service Manual
- Preface
- Table of Contents
- Chapter 1 Introduction
- Chapter 2 Mechanical Construction
- Chapter 3 Procedure of Disassembly
- Chapter 4 Troubleshooting Procedure
- Chapter 5 RMA Inspection Standard
- Chapter 6 Function Test and Alignment Procedure
- Chapter 7 Firmware Upgrade Procedure
- Chapter 8 DDC Key In Procedure
- Chapter 9 Panel Specification
- Chapter 10 Packing For Shipping
- Chapter 11 Appendix
- VP171sb-1.pdf
- Preface
- Flowchart for Repair
- Table of Contents
- Chapter 1 Introduction
- Chapter 2 Mechanical Construction
- Chapter 3 Procedure of Disassembly
- Chapter 4 Troubleshooting Procedure
- Chapter 5 RMA Inspection Standard
- Chapter 6 Function Test and Alignment Procedure
- Chapter 7 Firmware Upgrade Procedure
- Chapter 8 DDC Key-In Procedure
- Chapter 9 Panel Specification
- Chapter 10 Packing For Shipping
- Chapter 11 Appendix
- Reader's Response
- VP171 -page 11 only.pdf
- VP171 Series Service Manual
- Preface
- Table of Contents
- Chapter 1 Introduction
- Chapter 2 Mechanical Construction
- Chapter 3 Procedure of Disassembly
- Chapter 4 Troubleshooting Procedure
- Chapter 5 RMA Inspection Standard
- Chapter 6 Function Test and Alignment Procedure
- Chapter 7 Firmware Upgrade Procedure
- Chapter 8 DDC Key In Procedure
- Chapter 9 Panel Specification
- Chapter 10 Packing For Shipping
- Chapter 11 Appendix
- VP171 -page 11 only.pdf
- VP171 Series Service Manual
- Preface
- Table of Contents
- Chapter 1 Introduction
- Chapter 2 Mechanical Construction
- Chapter 3 Procedure of Disassembly
- Chapter 4 Troubleshooting Procedure
- Chapter 5 RMA Inspection Standard
- Chapter 6 Function Test and Alignment Procedure
- Chapter 7 Firmware Upgrade Procedure
- Chapter 8 DDC Key In Procedure
- Chapter 9 Panel Specification
- Chapter 10 Packing For Shipping
- Chapter 11 Appendix
- VP171 -page 11 only.pdf
- VP171 Series Service Manual
- Preface
- Table of Contents
- Chapter 1 Introduction
- Chapter 2 Mechanical Construction
- Chapter 3 Procedure of Disassembly
- Chapter 4 Troubleshooting Procedure
- Chapter 5 RMA Inspection Standard
- Chapter 6 Function Test and Alignment Procedure
- Chapter 7 Firmware Upgrade Procedure
- Chapter 8 DDC Key In Procedure
- Chapter 9 Panel Specification
- Chapter 10 Packing For Shipping
- Chapter 11 Appendix

3. Disconnect the wire between M/B and Power Board.
4. Unscrew 10 screws that secure M/B Shielding Bracket and Remove the EMI tape to remove M/B Shielding
Bracket.
4
X 7
X 3
85.AA123.030
85.4A323.040
M/B Shielding Bracket
6
5
X 4
X 6
85.1F123.060
85.005AG.075
Main Board
5. Unscew six hex screws that secure Main Board.
6. Unscrew four screws that secure Main Board to remove Main Board.
7. Disconnect the wires which are connected to Main Board.
7
EMI Tape
3
ViewSonic Corporation
21
Confidential – Do Not Copy
VP171/b/s