User Guide
Table Of Contents
- Introduction
- Shipping contents
- Controls and functions
- Setting up
- Positioning your projector
- Using the menus
- Adjusting your projector’s settings
- Connect the projector to your device
- Different menu options
- M1+ FW Upgrade
- Wallpaper
- Image Settings
- About the aspect ratio
- Auto Keystone
- V Keystone
- Brightness
- Contrast
- Projector Position
- Harman Kardon - Adjusting the audio settings
- Muting the Sound
- Adjusting the Sound level
- Adjusting the Audio Mode
- Adjusting the Light source settings
- Reset All Settings
- Eye Protection
- Viewing different file
- Using the 3D function
- OSD Menu System
- Specification sheet
- HDMI Support Video Timing
- HDMI Support PC Timing
- 3D Support Timing
- USB-C Support Timing
iv
Declaration of RoHS2 Compliance
This product has been designed and manufactured in compliance with Directive
2011/65/EU of the European Parliament and the Council on restriction of the use
of certain hazardous substances in electrical and electronic equipment (RoHS2
Directive) and is deemed to comply with the maximum concentration values issued
by the European Technical Adaptation Committee (TAC) as shown below:
Substance
Proposed Maximum
Concentration
Actual Concentration
Lead (Pb) 0.1% < 0.1%
Mercury (Hg) 0.1% < 0.1%
Cadmium (Cd) 0.01% < 0.01%
Hexavalent Chromium (Cr
6+
) 0.1% < 0.1%
Polybrominated biphenyls (PBB) 0.1% < 0.1%
Polybrominated diphenyl ethers (PBDE) 0.1% < 0.1%
Bis(2-ethylhexyl) phthalate (DEHP) 0.1% < 0.1%
Butyl benzyl phthalate (BBP) 0.1% < 0.1%
Dibutyl phthalate (DBP) 0.1% < 0.1%
Diisobutyl phthalate (DIBP) 0.1% < 0.1%
Certain components of products as stated above are exempted under the Annex III
of the RoHS2 Directives as noted below:
Examples of exempted components are:
1. Lead in glass of cathode ray tubes.
2. Lead in glass of uorescent tubes not exceeding 0.2% by weight.
3. Lead as an alloying element in aluminium containing up to 0.4% lead by weight.
4. Copper alloy containing up to 4% lead by weight.
5. Lead in high melting temperature type solders (i.e. lead-based alloys containing
85% by weight or more lead).
6. Electrical and electronic components containing lead in a glass or ceramic other
than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or
ceramic matrix compound.










