Specifications

Advance Product Information
April 27, 2005
12
TriQuint Semiconductor Texas Phone: [phone] Fax: [phone] Email: [e-mail] Web: www.triquint.com
Ordering Information
Part Package Style
TGA2922-SG SMT Gull Wing (Formed Leads)
Recommended Surface Mount Package Assembly
Proper ESD precautions must be followed while handling packages.
Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry.
TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven
vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed
in the table below.
Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement.
The volume of solder paste depends on PCB and component layout and should be well controlled to
ensure consistent mechanical and electrical performance.
Clean the assembly with alcohol.
Typical Solder Reflow Profiles
Reflow Profile SnPb Pb Free
Ramp-up Rate
3
°
C/sec 3
°
C/sec
Activation Time and
Temperature
60 – 120 sec @ 140 – 160
°
C 60 – 180 sec @ 150 – 200
°
C
Time above Melting Point 60 – 150 sec 60 – 150 sec
Max Peak Temperature
240
°
C260
°
C
Time within 5
°
C of Peak
Temperature
10 – 20 sec 10 – 20 sec
Ramp-down Rate
4 – 6
°
C/sec 4 – 6
°
C/sec
TGA2922-SG