Product specifications
Design Guide - VT82C694X Apollo Pro133 with VT82C686A
Preliminary Revision 0.5, November 19, 1999 26 Motherboard Design Guidelines
Technologies, Inc.
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(a) Component Layer (b) Ground Layer
(c) Power Layer (d) Solder Layer
Figure 2-19. VT82C686A Power and Ground Layout
Notes:
1. In Figure 2-19 (b) and (c), a black round dot represents a via with no connection to the specified layer and a white round dot
represents a via with a connection to the specified layer. For example, the white round dots in Figure 2-19 (b) are ground
connection vias and the white round dots in Figure 2-19 (c) are VCC3 connection vias.
2. The square-like rail in the center area of the VT82C686A chip on the component layer in Figure 2-19 (a) connects to ground.
The center square-like block representing an unused routing area connects to ground in Figure 2-19 (d).
3. Pin A1 of the VT82C686A chip is located at the upper-left corner.