Product specifications

Design Guide - VT82C694X Apollo Pro133 with VT82C686A
Preliminary Revision 0.5, November 19, 1999 8 Motherboard Design Guidelines
Technologies, Inc.
We ConnectWe Connect
2.1.2 "Super South" South Bridge Ballout Assignment
Ballout of the VIA "Super South" South Bridge is designed to minimize the number of crossover signals. Similarly to Figure 2-1,
the major signal group quadrants are shown in Figure 2-2. They are PCI, ISA, Hardware Monitoring, IDE1, IDE2 (shared with
Audio/Game), Super IO (including FDC, COM, LPT, and Infrared interface (not shown) ), USB, Keyboard & Mouse, and a group
of Power Control, GPIO & Reset. Please refer to the VT82C686A datasheet for more details on these ball assignments.
ISA
352-PIN BGA
SUPER SOUTH
VT82C686A
USB
Keyboard
& Mouse
FDC COM LPT
PCI
IDE1
IDE2
(Audio/Game)
Hardware
Monitoring
Power Control,
GPIO & Reset
1
A
(Top View)
Figure 2-2. Major Signal Group Distributions of "Super South" South Bridge Ballout (Top View)
Package Information:
• The VIA VT82C694X Apollo Pro133A North Bridge is a 510-pin Ball Grid Array (BGA) package. The package size is
35mm x 35mm and the grid matrix is 26x26.
• The VIA "Super South" South Bridge (VT82C686A) is a 352-pin BGA package. The package size is 27mm x 27mm and
the grid matrix is 20x20.