Product specifications

VT8237R Data Sheet
Revision 2.06 December 15, 2004 -173- Package Mechanical Specifications
539-Pin BGA
1.00
25.00
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
1234567891011121314151617181920212223242526
27.00 ±0.20
27.00 ±0.20
25.00
1.00
B
A
0.20(4X)
C
SEATING PLANE
30º TYP
Ø 0.60 ±0.10 (539x)
Ø 0.10
Ø 0.25
C
CA BSSS
S
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
AF
AE
AD
AC
AB
AAYWVUTRPNMLKJHGFEDCBA
PIN #1
CORNER
Ø 1.00(3X) REF
24.00 REF
27x27x2.23 mm
JEDEC Spec MS-034
24.00 REF
4.00*45º (4X)
1.17 REF
0.56 REF
0.50 ±0.10
2.23 ±0.13
0.15 C
Figure 8. Lead-Free Mechanical Specifications – 539 Pin Ball Grid Array Package
VT8237R
YYWWVV CCCCC
LLLLLLLLLL ○
G
○
C ○
M
Part Number
Y = Date Code Year
W = Date Code Week
V = Chip Version (CD)
L = Lot Code
Country of Assembly
(TAIWAN or CHINA)
Indicates “Lead-Free” Package