Product specifications

ProSavageDDR P4M266 – VT8751 P4 DDR SMA North Bridge
Revision 1.1, July 19, 2002 -62- Mechanical Specifications
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Technologies, Inc.
MECHANICAL SPECIFICATIONS
Figure 7. Mechanical Specifications - 664-Pin HSBGA Ball Grid Array Package with Heat Spreader
664-Pin BGA
1.27
35.56
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
1234567891011121314151617212223242526272829
37.50 ±0.20
37.50 ±0.20
35.56
1.27
B
A
0.20(4X)
1.17 REF
0.68 REF
C
SEATING PLANE
30º TYP
0.15 C
0.60 ±0.10 2.33 ±0.13
Ø 0.70 ±0.20 (664x)
Ø0.10
Ø0.30
C
CA BSSS
S
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
AF
AE
AD
AC
AB
AAYWVUTRPNMLKJHGFEDCBA
PIN #1
CORNER
Ø1.00(3X)REF
34.50 REF
37.5x37.5x2.33 mm
JEDEC Spec MO-151
34.50 REF
4.60*45º (4X)
181920
AG
AH
AJ
AJ
AH
AG
3
2
1
P4M266
VT8751
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Part Number (optional – if not
marked, chipset name should be
used for part identification)
Chipset Name
M
Date Code, Chip Version,
and Country of Assembl
y
Lot Code