Product specifications

CN333 Data Sheet
Revision 1.0, January 5, 2005 -72- Mechanical Specifications
MECHANICAL SPECIFICATIONS
Figure 5. Mechanical Specifications – 681-Pin HSBGA Ball Grid Array Package with Heat Spreader
AG
HSBGA-681
Ball Grid Array with Heat Spreader
31 x 31 x 2.23 mm
with 1.00 mm Ball Pitch
30º TYP
SEATING PLANE
A
B
C
D
E
F
H
G
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AH
AJ
AK
12345678910
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
PIN #1
CORNER
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
AG
ABCDEF HGJKLMNPRTUVWY
AA
AB
AC
AD
AE
AF AH
AJ
AK
0.68 REF.
1.17 REF.
C
0.20 (4X)
A
B
29.00
31.00 ±0.20
31.00 ±0.20
29.00
1.00
Ø 0.50~0.70 (681X)
Ø 0.10 M C
Ø 0.25 M C A M B M
29.00 REF.
29.00 REF.
2.00*45º (4X)
2.35±0.130.40~0.60
/ 1.00 (3X) REF.
1.00
JEDEC Spec MS-034
Ø 0.30 M C A S B S
HEAT SLUG
Ø 22.5 ~ 23.5
Ø 0.50 M C D S E S
// 0.25 C
// 0.35 C
0.20 C
Chip Name
CN333
YYWWVV TAIWAN
LLLLLLLLLL ○
C
○
M
Date Code, Chip Version
and Country of Assembl
y
Lot Code
Country of Assembly