User Manual
21
P
T
8
.
•
•
•
.03.2011
P
reparatio
n
The proced
• Switc
h
• Set ‘c
o
• Sort t
o
The followi
n
• SMT T
w
• Flux d
i
• Low s
o
T
emperatu
r
In normal
o
system is d
150W shor
t
maximum
o
In normal
u
provided b
y
Soldering
• PREPAR
A
centre
o
thickne
s
apply s
o
o [A]
P
o [B]
R
the c
duri
n
phas
e
o [C]
S
o [D]
C
Desolderi
n
• PREPAR
A
centre
o
o [A]
P
o [B]
R
the c
duri
n
time
o [C]
S
o [D]
C
Aftercare
• Clean fl
u
• Check s
o
• Test
.
Q&A
What Top
H
Betwee
n
What’s the
Approxi
m
Move th
compon
e
What pre-h
Betwee
n
n
ure for prep
h
on and wa
r
o
ntrol settin
g
o
ols and flu
x
n
g tools are
w
eezers, fin
i
spenser bo
t
o
lids and gel
r
e profile
o
peration th
e
esigned for
t
wave IR la
m
o
f 650W me
d
u
se, approxi
m
y
the back h
A
TION: plac
o
f the PCB p
r
s
s). Place an
o
lder paste t
o
P
REHEAT th
e
R
EFLOW: us
e
omponent u
n
g the reflo
w
e
time (nor
m
S
OAK for a
s
C
OOL: allow
n
g
A
TION: plac
o
f the PCB p
r
P
REHEAT th
e
R
EFLOW: us
e
omponent u
n
g the reflo
w
(normally 3
S
OAK for a
s
C
OOL – allo
w
u
x residue o
f
o
lder joints
H
eat setting
n
220 and 3
8
working dis
t
m
ately 5~1
0
e hand tool
e
nt.
eater settin
g
n
200 and 2
9
aring to re
w
r
m up.
g
s’ required
x
es required
.
required fo
r
e tipped
t
tle
/paste flux
e
componen
t
rework sing
m
p focused
d
ium wave
I
m
ately 25%
eater (pre-
h
e the PCB i
n
r
e-heater. F
o
d align com
p
o
the PCB b
e
e
fluxed co
m
e
the IR ha
n
p to reflow
t
w
phase so t
h
m
ally 30-45
s
hort period
the compo
n
e PCB in th
e
r
e-heater. A
p
e
fluxed co
m
e
the IR ha
n
p to reflow
t
w
phase so t
h
0-45 secon
d
s
hort period
w
the comp
o
f
f PCB if ne
c
should you
u
8
0°C. Norm
a
t
ance of the
0
mm when
in a scannin
g
should I u
s
9
0°C. Norm
a
w
ork SMT/B
G
for PCB/co
m
.
r
use in sold
e
t
is first put
le/double si
d
through a r
e
I
R.
of the ener
g
h
eater). Figu
n
the PCB h
o
o
r BGAs, ap
p
p
onent. No
t
e
fore placin
g
m
ponent/PC
B
n
d tool (ope
r
t
emperatur
e
h
erefore we
seconds for
soak (abou
t
n
ent to cool
e
PCB holde
r
p
ply a very
s
m
ponent/PC
B
n
d tool (ope
r
t
emperatur
e
h
erefore we
d
s for a sma
l
soak (abou
t
o
nent to coo
c
essary
u
se?
a
l setting is
IR Hand to
o
reworking a
g motion to
s
e?
a
l setting is
VTSDIR
6
G
A compone
n
m
ponent
e
ring/desol
d
through a
p
d
e and mix
e
e
flective ch
a
g
y is prove
d
re below sh
o
o
lder, positi
o
p
ly a very s
m
t
e – dependi
g
componen
t
B
to approxi
m
r
ated by pre
e
(200-225°
C
use the tim
e
a small PC
B
t
10 second
s
to below 18
r
, positionin
g
s
mall amou
n
B
to approxi
m
r
ated by pre
e
(200-225°
C
use the tim
e
l
l PCB).
t
10 second
s
l to below 1
8
240°C.
o
l and how
d
nd move up
heat leads,
240°C.
n
ts is as foll
o
d
ering opera
t
p
reheat stag
e
d technolog
y
a
mber syste
m
d
by the top
o
ws how th
e
ning the co
m
m
all amount
ng on the a
p
t
.
m
ately 120°
C
ssing the fo
o
C
). It is not
e
r on the IR
B
).
s
) the comp
o
0°C before
m
g
the compo
n
n
t of flux un
d
m
ately 120°
C
ssing the fo
o
C
). It is not
e
r on the IR
8
s
) the comp
o
8
0°C before
d
o I move it
to 30mm
w
taking abo
u
o
ws:
t
ions:
e
, followed
b
y
PCB. The
t
m
. The bott
o
heater, and
e
energy is
a
m
ponent sit
e
of gel flux
(
p
plication, y
C
(as meas
u
o
tswitch) fo
r
so easy to
m
810 control
o
nent allowi
n
m
oving the
P
n
ent site to
d
er/around
t
C
(as meas
u
o
tswitch) fo
r
so easy to
m
8
10 controll
e
o
nent allowi
n
moving the
for rework?
w
hen removi
n
u
t one secon
b
y a reflow
s
t
op heat is
d
o
m heater d
e
75% of the
a
pplied to a
c
e
to be rew
o
(
approx. 0.1
y
ou may be
r
u
red by the
I
r
the reflow
m
easure te
m
ler to limit t
n
g the joint
s
P
CB.
be reworke
d
t
he compon
e
u
red by the
I
r
the reflow
m
easure te
m
er to limit t
h
n
g the joint
s
PCB.
n
g compone
d for each s
c
©Vellema
n
s
tage. The
d
erived from
e
livers a
energy is
c
omponent.
rked over t
h
- 0.15mm)
r
equired to
I
R sensor).
phase to he
a
m
perature
he reflow
s
to fully bo
n
d
over the
e
nt.
I
R sensor).
phase to he
a
m
perature
h
e reflow ph
a
s
to fully bo
n
nts.
c
an of the
n
nv
a
h
e
a
t
n
d.
a
t
a
se
n
d.