Data Sheet

ams Datasheet Page 19
[v1-00] 2016-Jul-13 Document Feedback
TCS3200, TCS3210 − Manufacturing Information
The Plastic Small Outline IC package (D) has been tested and
has demonstrated an ability to be reflow soldered to a PCB
substrate.
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The component should be limited to a maximum
of three passes through this solder reflow profile.
Figure 19:
TCS3200, TCS3210 Solder Reflow Profile
Figure 20:
TCS3200, TCS3210 Solder Reflow Profile Graph
Parameter Reference TCS32x0
Average temperature gradient in preheating 2.5°C/s
Soak time t
soak
2 to 3 minutes
Time above 217°C t
1
Max 60 s
Time above 230°C t
2
Max 50 s
Time above T
peak
- 10°C t
3
Max 10 s
Peak temperature in reflow T
peak
260°C (-0°C/5°C)
Temperature gradient in cooling Max -5°C/s
Manufacturing Information
t
3
t
2
t
1
t
soak
T
3
T
2
T
1
T
peak
Not to scale — for reference only
Time (s)
Temperature (C)