Data Sheet

ams Datasheet Page 17
[v1-00] 2016-Jul-13 Document Feedback
TCS3200, TCS3210 − Packaging Mechanical Data
This SOIC package consists of an integrated circuit mounted on
a lead frame and encapsulated with an electrically
nonconductive clear plastic compound. The TCS3210 has a
4 × 6 array of photodiodes with a total size of
0.54mm by 0.8mm. The photodiodes are 110μm × 110μm in size
and are positioned on 134μm centers.
Figure 17:
Package D - TCS3210 Plastic Small Outline IC Packaging Configuration
Note(s):
1. All linear dimensions are in millimeters.
2. The center of the 0.54mm by 0.8mm photo-active area is referenced to the upper left corner tip of the lead frame (Pin 1).
3. Package is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
4. This drawing is subject to change without notice.
PACKAGE D PLASTIC SMALL-OUTLINE
A
1.75
1.35
0.50
0.25
4.00
3.80
6.20
5.80
45
0.88 TYP TOP OF
SENSOR DIE
5.00
4.80
5.3
MAX
1.27
0.41
0.25
0.10
0.25
0.19
DETAIL A
PIN 1
6  1.27
0.510
0.330
8 
 2.8 TYP
CLEAR WINDOW
2.12
 0.250
3.00  0.250
NOTE B
Pb
PIN 1
TOP VIEW BOTTOM VIEW
SIDE VIEW
END VIEW
Green
RoHS