Data Sheet

Page 16 ams Datasheet
Document Feedback [v1-00] 2016-Jul-13
TCS3200, TCS3210 − Packaging Mechanical Data
This SOIC package consists of an integrated circuit mounted on
a lead frame and encapsulated with an electrically
nonconductive clear plastic compound. The TCS3200 has an
8 × 8 array of photodiodes with a total size of 1mm by 1mm.
The photodiodes are 110μm × 110μm in size and are positioned
on 134μm centers.
Figure 16:
Package D - TCS3200 Plastic Small Outline IC Packaging Configuration
Note(s):
1. All linear dimensions are in millimeters.
2. The center of the 1mm by 1mm photo-active area is referenced to the upper left corner tip of the lead frame (Pin 1).
3. Package is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
4. This drawing is subject to change without notice.
Packaging Mechanical Data
PACKAGE D PLASTIC SMALL-OUTLINE
A
1.75
1.35
0.50
0.25
4.00
3.80
6.20
5.80
45
0.88 TYP TOP OF
SENSOR DIE
5.00
4.80
5.3
MAX
1.27
0.41
0.25
0.10
0.25
0.19
DETAIL A
PIN 1
6  1.27
0.510
0.330
8 
 2.8 TYP
CLEAR WINDOW
2.12
 0.250
3.00  0.250
NOTE B
Pb
PIN 1
TOP VIEW BOTTOM VIEW
SIDE VIEW
END VIEW
Green
RoHS