Data Sheet

MFRC522 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.9 — 27 April 2016
112139 89 of 95
NXP Semiconductors
MFRC522
Standard performance MIFARE and NTAG frontend
Detailed package information can be found at:
http://www.nxp.com/package/SOT617-1.html.
18. Handling information
Moisture Sensitivity Level (MSL) evaluation has been performed according to
SNW-FQ-225B rev.04/07/07 (JEDEC J-STD-020C). MSL for this package is level 1 which
means 260 C convection reflow temperature.
Dry pack is not required.
Unlimited out-of-pack floor life at maximum ambient 30 C/85 % RH.
19. Packing information
Fig 34. Packing information 1 tray
001aaj740
strap 46 mm from corner
tray
chamfer
PIN 1
chamfer
PIN 1
printed plano box
ESD warning preprinted
barcode label (permanent)
barcode label (peel-off)
QA seal
Hyatt patent preprinted
The straps around the package of
stacked trays inside the plano-box
have sufficient pre-tension to avoid
loosening of the trays.
In the traystack (2 trays)
only ONE tray type* allowed
*one supplier and one revision number.