User's Manual

Table of Contents
CDMRF102..................................................................................................................................................... 1
TCU PHONE MODULE.................................................................................................................................. 1
1 INTRODUCTION / OVERVIEW .................................................................................................................. 6
1.1 QSC 6055 Chipset .............................................................................................................................. 6
1.1.1 QSC 6055 Features........................................................................................................................... 6
1.2 IS- Mobile Standards .......................................................................................................................... 7
1.3 Acronym Definitions........................................................................................................................... 8
1.4 Development Tools for the Phone Module....................................................................................... 8
1.4.1 LT Box...................................................................................................................................... ...……8
2 MECHANICAL DESCRIPTION .................................................................................................................. 9
2.1 Phone Module Mechanical Outline ................................................................................................... 9
2.2 Phone Module I/O Connector ............................................................................................................ 9
2.2.1 I/O Connector Drawing and Supplier Part Number…......................................................................... 9
2.2.2 I/O Connector Electrical Characteristics ….......................................................................................10
2.2.2.1 I/O Connector Pin Assignment ..................................................................................................... 10
3 OPERATING TEMPERATURE AND STORAGE ..................................................................................... 13
3.1 Temperature ...................................................................................................................................... 13
3.1.1 Storage Temperature….................................................................................................................... 13
3.1.2 Operating Temperature…................................................................................................................ 13
4 ELECTRICAL INTERFACE...................................................................................................................... 14
4.1 Design Guidelines ............................................................................................................................ 14
4.1.1 Component Derating…..................................................................................................................... 14
4.1.1.1 Ceramic Capacitors / Parallel Plate Capacitors……….................................................................. 14
4.1.1.2 Electrolytic Capacitors .................................................................................................................. 14
4.1.1.3 Tantalum Capacitors..................................................................................................................... 14
4.1.2 Communication Pins and Unused Pins............................................................................................ 14
4.2 Supply Voltage................................................................................................................................... 14