Operating instructions
Table Of Contents
- Comfort Panels
- Legal information
- Preface
- Table of contents
- 1 Overview
- 2 Safety instructions
- 3 Mounting and connecting the HMI device
- 3.1 Preparation for mounting
- 3.2 Mounting the device
- 3.3 Connecting the device
- 3.3.1 Notes on connection
- 3.3.2 Connecting the equipotential bonding circuit
- 3.3.3 Connecting the power supply
- 3.3.4 Connecting the configuration PC
- 3.3.5 Connecting the PLC
- 3.3.6 Connecting a USB device
- 3.3.7 Connecting a printer
- 3.3.8 Connecting an audio device
- 3.3.9 Switching on and testing the HMI device
- 3.3.10 Securing the cables
- 4 Commissioning the device
- 4.1 Overview
- 4.2 Using the service concept
- 4.3 Operating the device
- 4.4 Configuring the device
- 4.4.1 Reference for functions
- 4.4.2 Changing settings for operation
- 4.4.3 Changing password protection
- 4.4.4 Changing HMI device settings
- 4.4.4.1 Setting the date and time
- 4.4.4.2 Changing regional settings
- 4.4.4.3 Backup registry information
- 4.4.4.4 Changing monitor settings
- 4.4.4.5 Setting the screen saver
- 4.4.4.6 Changing the printer properties
- 4.4.4.7 Enabling sound and setting sound volume
- 4.4.4.8 Assigning sound to an event
- 4.4.4.9 Restarting the HMI device
- 4.4.4.10 Displaying information about the HMI device
- 4.4.4.11 Displaying system properties
- 4.4.4.12 Displaying memory distribution
- 4.4.5 Setting storage location
- 4.4.6 Setting the delay time
- 4.4.7 Setting the uninterruptible power supply
- 4.4.8 State of uninterruptible power supply
- 4.4.9 Enabling PROFINET services
- 4.4.10 Synchronizing the time via the time server
- 4.4.11 Changing transfer settings
- 4.4.12 Configuring network operation
- 4.4.13 Changing Internet settings
- 4.4.14 Saving to external storage device (backup)
- 4.4.15 Restoring from external storage device
- 4.4.16 Activate memory management
- 5 Commissioning a project
- 6 Operating a project
- 7 Maintenance and care
- 8 Technical specifications
- 8.1 Certificates and approvals
- 8.2 Directives and declarations
- 8.3 Dimension drawings
- 8.3.1 Dimension drawings of the FKP400 Comfort
- 8.3.2 Dimension drawings of the KP700 Comfort
- 8.3.3 Dimension drawings of the KP900 Comfort
- 8.3.4 Dimension drawings of the KP1200 Comfort
- 8.3.5 KP1500 Comfort dimension drawings
- 8.3.6 Dimension drawings of the KTP400 Comfort
- 8.3.7 Dimension drawings of the TP700 Comfort
- 8.3.8 Dimension drawings of the TP900 Comfort
- 8.3.9 Dimension drawings of the TP1200 Comfort
- 8.3.10 Dimension drawings of TP1500 Comfort
- 8.3.11 Dimension drawings of TP1900 Comfort
- 8.3.12 Dimension drawings of TP2200 Comfort
- 8.3.13 Dimensions for labeling strips
- 8.4 Technical specifications
- 8.5 Bit assignment of the direct keys
- 8.6 Description of the ports
- 8.7 Communication with PLCs
- 8.8 Scope of functions with WinCC
- A Technical Support
- B Abbreviations
- Glossary
- Index
Mounting and connecting the HMI device
3.3 Connecting the device
Comfort Panels
42 Operating Instructions, 03/2012, A5E03404994-02
3.3.2 Connecting the equipotential bonding circuit
Differences in electrical potential
Differences in electrical potential can develop between spatially separated plant
components. Such electrical potential differences can lead to high equalizing currents over
the data cables and therefore to the destruction of their interfaces. Equalizing currents can
develop if the cable shielding is terminated at both ends and grounded to different plant
parts.
Differences in potential may develop when a system is connected to different mains
supplies.
General requirements for equipotential bonding
Differences in potential must be reduced by means of equipotential bonding in order to
ensure trouble-free operation of the relevant components of the electronic system. The
following must therefore be observed when installing the equipotential bonding circuit:
● The effectiveness of equipotential bonding increases as the impedance of the
equipotential bonding conductor decreases or as its cross-section increases.
● If two plant parts are interconnected by means of shielded data cables and their shielding
is bonded at both ends to the grounding/protective conductor, the impedance of the
additionally installed equipotential bonding cable must not exceed 10% of the shielding
impedance.
● The cross-section of an equipotential bonding conductor must be capable of handling the
maximum equalizing current. Experience has shown that equipotential bonding
conductors with a minimum cross-section of 16 mm² are the best.
● Use equipotential bonding conductors made of copper or galvanized steel. Establish a
large surface contact between the equipotential bonding conductors and the
grounding/protective conductor and protect these from corrosion.
● Use a suitable cable clip to clamp the shield of the data cable flush to the equipotential
bonding rail. Keep the length of cable between the HMI device and the equipotential
bonding rail as short as possible.
● Route the equipotential bonding conductor and data cables in parallel and with minimum
clearance between these.