User's Manual

Solutions for a Real Time World NEMO2 Design Guidelines
Applicationnote
PCB Stack, Materials, Drill & Notes
Figure11:NEMO2EvaluationBoardPCBStackUp
NOTES:
1.) Material:
a. Epoxy glass laminate and prepreg. Type, Standard FR4. Finished external
layer 1 oz copper
b. Finished thickness 0.8 ± 5%mm
2.) Drilling:
a. Diameters in drill table are finished hole sizes, tolerance ± 0.0762mm.
b. Teardrop allowed on entry of via on every trace layer
3.) Final Fabrication:
a. Soldermask primary and secondary side of the board using liquid
photoimagable mask material over bare copper per IPC-SM840. Mask
artworks provided are 1:1. Solder mask color “GREEN”
4.) Copper Finish shall be immersion silver (2 ~ 8 u)
5.) Manufacture board to be in accordance with performance standard IPC-A-
6011/6012 Class 2.
6.) Maximum warp or twist shall not exceed 1%
7.) PCB shall be RoHS and WEE compliance directive 2002/95/EC
8.) Board outline dimension tolerance ± 0.13mm unless otherwise specified.