User Manual

Smart Machine Smart Decision
SIM7100_Hardware_Design_V1.02 2015-06-16
6.3 Typical SMT Reflow Profile
SIMCom provides a typical soldering profile. Therefore the soldering profile shown below is only
a generic recommendation and should be adjusted to the specific application and manufacturing
constraints.
Figure 39: The ramp-soak-spike Reflow Profile of SIM7100
Note: For more details about secondary SMT, please refer to the document [21].
6.4 Moisture Sensitivity Level (MSL)
SIM7100 is qualified to Moisture Sensitivity Level (MSL) 5 in accordance with JEDEC J-STD-033.
If the prescribed time limit is exceeded, users should bake modules for 192 hours in drying
equipment (<5% RH) at 40+5/-0°C, or 72 hours at 85+5/-5°C. Note that plastic tray is not
heat-resistant, and only can be baked at 45° C.
Table 37: Moisture Sensitivity Level and Floor Life
Moisture Sensitivity Level
(MSL)
Floor Life (out of bag) at factory ambient≤30°C/60% RH or as
stated
1 Unlimited at ≦30℃/85% RH
2 1 year
2a 4 weeks
3 168 hours
4 72 hours
5 48 hours
5a 24 hours
6 Mandatory bake before use. After bake, it must be reflowed within the