Datasheet

Philips Semiconductors Linear Products Product specification
NE502010-Bit µP-compatible D/A converter
August 31, 1994
758
BLOCK DIAGRAM
(15)
(14)
(22)
(20)
(23)
(24)
(17)
(18)
BIPOLAR
OFFSET
+V
REF
IN
ANALOG
GND
AMP
COMP
SUM
NODE
DAC OUTPUT CURRENT
DAC SWITCHES
(19)
(13)
MSB
LSB
DIGITAL GND(1)
–V
CC
INT
V
REF
(11)
DB9
(10)
DB8
(9)
DB7
(8)
DB6
(7)
DB5
(6)
DB4
(5)
DB3
(4)
DB2
LE
2
V
OUT
+
–
V
REF
OUT
V
REF
ADJ
+
–
Q
R
Q
9
Q
8
Q
7
Q
6
Q
5
Q
4
Q
3
Q
2
Q
1
Q
0
Q
T
(3)
DB1
(2)
DB0
LATCHES AND
SWITCH DRIVERS
(12)
LE
1
(21)
+V
CC
R
BIP
R
REF
R
(16)
–V
REF
IN
R
R
fb
ABSOLUTE MAXIMUM RATINGS
SYMBOL PARAMETER RATING UNIT
V
CC
+
Positive supply voltage 18 V
V
CC
-
Negative supply voltage -18 V
V
IN
Logic input voltage 0 to 18 V
V
REF IN
Voltage at +V
REF
input 12 V
V
REF ADJ
Voltage at V
REF
adjust 0 to V
REF
V
V
SUM
Voltage at sum node 12 V
I
REFSC
Short-circuit current to ground at V
REF OUT
Continuous
I
OUTSC
Short-circuit current to ground or either supply at V
OUT
Continuous
P
D
Maximum power dissipation T
A
=25°C, (still-air)
1
F package 2150 mW
N package 2150 mW
T
A
Operating temperature range NE5020 0 to +70 °C
T
STG
Storage temperature range -65 to +150 °C
T
SOLD
Lead soldering temperature
(10 sec. max)
300 °C
NOTES:
1. Derate above 25°C at the following rates:
F package at 17.2mW/°C
N package at 17.2mW/°C