User Manual
Data sheet
BMP085
Page 4
BST-BMP085-DS000-06 | Revision 1.3 | August 2011 Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to
third parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.
Index of Contents
1. ELECTRICAL CHARACTERISTICS ....................................................................................... 6
2. ABSOLUTE MAXIMUM RATINGS .......................................................................................... 8
3. OPERATION ............................................................................................................................ 9
3.1 GENERAL DESCRIPTION......................................................................................................... 9
3.2 GENERAL FUNCTION AND APPLICATION SCHEMATICS .............................................................. 9
3.3 MEASUREMENT OF PRESSURE AND TEMPERATURE............................................................... 11
3.4 CALIBRATION COEFFICIENTS ............................................................................................... 12
3.5 CALCULATION PRESSURE AND TEMPERATURE ...................................................................... 13
3.6 CALCULATION ABSOLUTE ALTITUDE ..................................................................................... 15
3.7 CALCULATING PRESSURE AT SEA LEVEL............................................................................... 15
4. I²C INTERFACE ..................................................................................................................... 16
4.1 I²C SPECIFICATION.............................................................................................................. 16
4.2 DEVICE AND REGISTER ADDRESS......................................................................................... 17
4.3 I²C PROTOCOL.................................................................................................................... 17
4.4 START TEMPERATURE AND PRESSURE MEASUREMENT ......................................................... 18
4.5 READ A/D CONVERSION RESULT OR E²PROM DATA ............................................................ 19
5. PACKAGE ............................................................................................................................. 20
5.1 PIN CONFIGURATION ........................................................................................................... 20
5.2 OUTLINE DIMENSIONS ......................................................................................................... 21
5.2.1 TOP VIEW.................................................................................................................................. 21
5.2.2 TOP VIEW WITH LID .................................................................................................................... 22
5.2.3 SIDE VIEW WITH LID.................................................................................................................... 22
5.3 DEVICE MARKING ................................................................................................................ 22
5.4 TAPE ON REEL .................................................................................................................... 23
5.5 PRINTED CIRCUIT BOARD (PCB) DESIGN .............................................................................. 24
5.6 MOISTURE SENSITIVITY LEVEL AND SOLDERING .................................................................... 24
5.7 ROHS COMPLIANCY............................................................................................................ 25
5.8 MOUNTING AND ASSEMBLY RECOMMENDATIONS .................................................................. 25