User Manual

Data sheet
BMP085
Page 24
BST-BMP085-DS000-06 | Revision 1.3 | August 2011 Bosch Sensortec
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to
third parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.
5.5 Printed circuit board (PCB) design
Figure 12: Recommended PCB design (top view)
5.6 Moisture sensitivity level and soldering
The BMP085 is classified MSL 1 (moisture sensitivity level) according to IPC/JEDEC standards
J-STD-020D and J-STD-033A.
The device can be soldered Pb-free with a peak temperature of 260°C for 20 to 40 sec. The
minimum height of the solder after reflow shall be at least 50μm. This is required for good
mechanical decoupling between the sensor device and the printed circuit board (PCB).
The BMP085 devices have to be soldered within 6 months after shipment (shelf life). To ensure
good solder-ability, the devices shall be stored at room temperature (20°C).
The soldering process can lead to an offset shift of typically 1hPa.