Datasheet

IR2106(4)
(
S
)
2 www.irf.com
Symbol Definition Min. Max. Units
V
B
High side floating absolute voltage -0.3 625
V
S
High side floating supply offset voltage V
B
- 25 V
B
+ 0.3
V
HO
High side floating output voltage V
S
- 0.3 V
B
+ 0.3
V
CC
Low side and logic fixed supply voltage -0.3 25
V
LO
Low side output voltage -0.3 V
CC
+ 0.3
V
IN
Logic input voltage V
SS
- 0.3 V
CC
+ 0.3
V
SS
Logic ground (IR21064 only) V
CC
- 25 V
CC
+ 0.3
dV
S
/dt Allowable offset supply voltage transient — 50 V/ns
P
D
Package power dissipation @ T
A
≤ +25°C (8 lead PDIP) — 1.0
(8 lead SOIC) — 0.625
(14 lead PDIP) — 1.6
(14 lead SOIC) — 1.0
Rth
JA
Thermal resistance, junction to ambient (8 lead PDIP) — 125
(8 lead SOIC) — 200
(14 lead PDIP) — 75
(14 lead SOIC) — 120
T
J
Junction temperature — 150
T
S
Storage temperature -50 150
T
L
Lead temperature (soldering, 10 seconds) — 300
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-
eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured
under board mounted and still air conditions.
V
°C
°C/W
W