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Copyright LZE GmbH 2021
Package and Circuit Connection
Eine gemeinsame Initiative von
3
Package and Circuit Connection
3.1
Footprint and Dimensions
Bottom view Top view Side view
Parameter
Symbol
Min
Typ
Max
Unit
Note
Hall Sensor Size
HS
250
µm
Hall Sensor Distance
HD
2500
µm
Chip length
X
3015
3035
3055
µm
Chip width
Y
2015
2035
2055
µm
Chip thickness
T
570
600
630
µm
X-Distance chip border
to bumps
x0
285
µm
Bump pitch X-direction
x1
500
µm
Y-Distance chip border
to bumps
y0
535
µm
Bump pitch Y-direction
y1
500
µm
Wafer thickness
h1
325
335
355
µm
Backside Laminate
h2
25
µm
Bump height
h3
240
µm
Solder Ball Coplanarity
CC
40
µm
Hall Sensor vertical
position
HV
30
µm
Bump diameter
D
315
325
335
µm
Package
dimensions
x0 x1 D
X
Y
y0 y1
HD
A
B
C
6 5 4 3 2 1
HS
X
A
1
FH3D02
XXXX
Y
Z
h3
T
h2
h1
HV
CC